Method for manufacturing of opto-electric hybrid board and opto-electric hybrid board obtained thereby



<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an opto-electric hybrid board which is capable of reducing the number of steps for the manufacture of the opto-electric hybrid board and which achieves the reduction in thickness of the opto-electric hybrid board to be manufactured, and also to provide an opto-electric hybrid board obtained thereby. <P>SOLUTION: A resist layer is formed on a core-forming resin layer, and is then formed into a predetermined pattern. Resultant portions of the core-forming resin layer serve as cores (optical interconnect lines) 3. Next, a thin metal film 5 is formed on the under cladding layer 2 so as to cover the resist layer and the cores 3. Thereafter, the resist layer is removed together with portions of the thin metal film 5 lying on the surface of the resist layer. Electroplating is performed on the remaining portions of the thin metal film 5 to fill grooves 6 defined between adjacent cores 3 and the cores 3 with electroplated layers 7a obtained by the electroplating. The electroplated layers 7a serve as electrical interconnect lines 7. <P>COPYRIGHT: (C)2009,JPO&INPIT
【課題】光電気混載基板を製造する際の工程を減らすことができ、さらに、製造される光電気混載基板の薄型化を図ることができる光電気混載基板の製造方法およびそれによって得られた光電気混載基板を提供する。 【解決手段】コア用樹脂層上にレジスト層を形成した後、それを所定のパターンに形成し、そのコア用樹脂層部分をコア(光配線)3とする。ついで、アンダークラッド層2上に金属薄膜5を、レジスト層およびコア3を被覆した状態で形成し、その後、レジスト層を、その表面の金属薄膜5と共に除去する。つぎに、残存した金属薄膜5に対して電解めっきを施すことにより、隣接するコア3とコア3との間の溝部6を、電解めっきによるめっき層7aで埋め、そのめっき層7aを電気配線7とする。 【選択図】図2




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