Electronic apparatus and method of manufacturing the same

電子装置およびその製造方法

Abstract

【課題】セラミック基板の一面に樹脂部材を設け、この樹脂部材とヒートシンクとを接着剤を介して接着してなる電子装置において、接着剤中のボイドの発生を極力防止し、放熱性の低下を抑制する。 【解決手段】樹脂部材40をセラミック基板20の一面に設けた後、樹脂部材40を加熱処理し、その後、接着剤30による接着を行う。ここで、樹脂部材40を100℃〜110℃で定重量となるまで乾燥させたときの当該定重量に対する、樹脂部材40が吸収した水分量の百分率を吸水率としたとき、樹脂部材40の加熱処理は、樹脂部材40の吸水率が3%未満となるように樹脂部材40を加熱する。 【選択図】図1
<P>PROBLEM TO BE SOLVED: To prevent void generation in adhesive as much as possible, and to suppress deterioration of heat dissipation in an electronic apparatus, wherein a resin member is arranged over the whole surface of a ceramic substrate and the resin member is adhered to a heatsink with adhesive. <P>SOLUTION: After forming a resin member 40 over the whole surface of a ceramic substrate 20, the resin member 40 is heat-treated, and then the resin member 40 is adhered with adhesive 30. Heat treatment for the resin member 40 is performed so that the percentage of moisture content may be less than 3%. The percentage of moisture content is defined as a ratio of moisture content that the resin member 40 absorbs to the constant weight of the resin member 40. The constant weight is the weight of the resin member 40 when it is dried up to 100°C to 110°C. <P>COPYRIGHT: (C)2009,JPO&INPIT

Claims

Description

Topics

Download Full PDF Version (Non-Commercial Use)

Patent Citations (6)

    Publication numberPublication dateAssigneeTitle
    JP-2001257437-ASeptember 21, 2001Denso Corp, 株式会社デンソー電子回路基板及びその製造方法
    JP-2001335602-ADecember 04, 2001Jsr Corp, ジェイエスアール株式会社Curable composition for thermal conductive sheet, thermal conductive sheet and its production method
    JP-H0582686-AApril 02, 1993Oki Electric Ind Co Ltd, 沖電気工業株式会社Semiconductor heat sink structure
    JP-H06302728-AOctober 28, 1994Oki Electric Ind Co Ltd, 沖電気工業株式会社セラミック多層基板上におけるlsi放熱構造
    JP-S59119749-AJuly 11, 1984Toshiba CorpSemiconductor device
    JP-S6376356-AApril 06, 1988Hitachi LtdAutomatic device for fixing fin

NO-Patent Citations (0)

    Title

Cited By (0)

    Publication numberPublication dateAssigneeTitle